In recent years, building, maintaining, and evolving proprietary network systems for telecom-grade applications that are highly available and “always on” have become increasingly prohibitive from the perspective of cost, risk management, time to revenue, and so on. The custom-built approach becomes even less cost effective as Communications Service Providers (CSPs) move toward offering cloud-based services, where they have to compete with non-traditional providers that offer such services on networks built using Commercial Off-The-Shelf (COTS) building blocks.
A change in market dynamics is causing a fundamental paradigm shift in industry’s thinking: Instead of continuing to invest precious Research and Development (R&D) resources and dollars to build expensive, special-purpose proprietary systems with the hope that they will never fail, industry leaders are now assuming that there will be hardware and software failures and thus designing systems and applications that continue to provide end-user service in the presence of such failures.
refer to : http://xtca-systems.com/articles/engineered-cots-network-systems/
in vehicle computer, Industrial PC, single board computer
The Reliability Information Analysis Center (RIAC) was used to gather, keep, and manage the data brought in by industry contributors. RIAC is a DoD information analysis center sponsored by the Defense gaming platform Technical Information Center. As an active member of the working group and an unbiased, third-party DoD agency, the RIAC is serving as the repository for any data that is contributed in support of this effort. In this capacity, the RIAC can provide Nondisclosure Agreements (NDAs) to protect any data that a potential contributor wishes to remain gaming platform. The RIAC ensures that all submitted data is properly sanitized, such that no proprietary information is provided to the at-large MIL-HDBK-217 working group.
refer to: http://vita-technologies.com/articles/vita-and-reliability-reliability-prediction-challenges/
3D audio assistance blades
HARTING Mitronics AG, Switzerland, a company of the HARTING Group, Germany, is noted for its expertise in Molded Interconnect Device (MID) technology, a 3D contour-following electromechanical embedded technology. A hearing aid (Figure 2) currently in production at Siemens Audiological (Medical), Germany, using MID technology was runner-up for the Hermes Award for product innovation at the Hannover Messe Fair, and won the MID Industrial Prize at Productronica in Munich. With MID technology, Siemens Medical can use three directional stereoscopic microphones and ear-to-ear wireless communication to enable simultaneous 3D hearing with optimized adaptive noise cancellation in a device smaller than traditional hearing aids, so it is practically embedded in the human ear. HARTING Mitronics used a laser system from LPKF, Germany, in a laser direct structuring process to produce the MID devices.
refer to: http://embedded-computing.com/articles/embedded-medical-biological-applications/#at_pco=cfd-1.0
in-vehicle pc, Industrial PC, single board computer
the new Atom series solutions that include AMB-D255T1 Mini-ITX industrial mainboard and AMB-N280S1 fanless 3.5-inch single board computer. AMB-D255T1 is equipped with Intel D2550 Atom processor and Intel N2800 Atom processor is on AMB-N280S1 both have 5~7 years product life cycle for longevity support.
The embedded world Exhibition&Conference is the world’s biggest exhibition of its kind and the meeting-place of the international embedded community.
Now for the eleventh time in 2013. Exhibitors from all over the world present the entire spectrum of embedded systems: hardware, software, tools and services. “The embedded world Exhibition&Conference is growing continuously and rapidly in the same way that the embedded sector is gaining in importance – the embedded community can look forward to a record event,” says Alexander Mattausch, Exhibition Manager of embedded world.
Acrosser ——> Booth Hall 2 2-519
The embedded world Conference is Europe’s top gathering for all embedded system developers. It is also the mirror and flagship of a community that more than almost any other has become the innovation driver for a whole society.
The Steering Board of international experts has assessed the many papers submitted and assembled a top-class conference programme, which is intended primarily for embedded hardware and software developers.It presents proposals for solutions to present and future challenges. This will provide in-depth coverage of methods that will succeed in shortening the development time of Embedded Systems drastically and reduce the error rate again – an important and pioneering issue that will be tackled at the conference for the first time in an extra session,” says Sturm.
Besides other key themes, the embedded world Conference 2013 focuses on:
- Cryptography and Embedded Security
- Managing Embedded System Development and Life Cycle
- Software Development in High Level Languages
- Internet Technology
More information about the programme for the embedded world Conference 2013 and registration is available at: http://www.embedded-world.eu/
AMB-D255T1, which carries the Intel dual- core 1.86GHz Atom Processor D2550. AMB-D255T1 features powerful graphic performance via VGA and HDMI, DDR3 SO-DIMM support, mSATA socket with USB signals and SIM slot, and a DC jack for easy power in. AMB-D255T1 also provides complete I/O such as 4 x COM ports, 6 x USB2.0 ports, 1 x GbE RJ-45 port, 1 x SATA port with power connector.
AMB-D255T1 can support dual displays via VGA, HDMI or LVDS. AMB-D255T1 has one MiniPCIe type expansion slot with SIM card socket for customer’s expansion.
acrosser designs AMB-D255T1 as the slim type with single layer I/O ports to make the board total height less than 20mm, with external AC/DC power adaptor which is very suitable for applications with limited space likes Digital Signage, POS or thin client system.
Intel H61 with CoreTM i7/ i5/ i3 Mini-ITX Motherboard, DDR3-1333,SATA II, USB 2.0, PCIe x4, DVI-D, VGA, COM, GbE
in-vehicle computer, Industrial PC, single board computer
AMB-IH61T1 has two DDR3 SO-DIMM sockets to support up to 16GB of system memory. Onboard 18/24-bit dual channels LVDS interface support HD resolution LCD panel directly made it suitable for digital signage and Panel PC applications.
Coming with acrosser’s 7 years product longevity service, AMB-IH61T1 is the perfect solution to deliver high computing power for a wide range of applications such as industrial automation, kiosk, digital signage, and ATM machines.
1. Intel LGA1155 Socket supports cross compatible with Intel Core i7/ i5/ i3 desktop processors
2. Supports Intel Xeon SP processors
3. Two 204-pin SO-DIMM sockets support DDR3 1333/ 1066 SDRAM up to 16GB
4. 6 x COM, 8 x USB2.0, 3 x SATA II, 8-bit GPIO, 1 x PCI-E x4, 1 x Mini-PCI-E
in-vehicle computer AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform. AIV-HM76V0FL adopts acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as 4 USB 3.0, can bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.
AIV-HM76V0FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, over current protection, reverse voltage protection and automotive fuse. These designs enable AIV-HM76V0FL to pass the strict ISO-7637-2 test what is specifically defined for equipments installed in various vehicles.
The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in-vehicle applications.
The AIV-HM76V0FL’s fanless thermal design provides the high reliability in vehicle applications. It utilizes advanced heat pipe, heat sink, and thermal pad to solve the problem of heat generated by CPU, Chipset, DRAM and power devices. This is a big challenge for designing a fanless computer what supports up to 45 Watts quad core of core i7-3720QM processors. All components used in AIV-HM76V0FL are industrial proven and only solid state capacitors are utilized for high MTBF.
The AIV-HM76V0FL is available in October, 2012. For more product information, please visit Acrosser product pages.
AR-ES5630FL is the most powerful embedded computer that overcome high heat problem to achieve fanless design and output great graphic acceleration and meet crucial computing demand.
AR-ES5630FL features 4 USB ports (2 onboard and 2 internal), 4 high speed RS-232 (one of them can be set as RS-422/485), dual Giga LAN, 1x IDE, 1xSATA, 5.1CH audio, 8 bit GPIO, PS2 KB/MS and one Compact Flash Type II Socket
AR-ES5630FL is a fanless design embedded box computer, with form factor 165x251x67 mm (DxWxH), Its advanced thermal heat-sink module design with heat-pipe efficiently vent the high temperature heat from Core 2 Duo 2.2GHz and make system cool remain its perfect computing performance. The high performance throughput makes AR-ES5630FL system easily be applied in every application such as gaming
, gambling, high-end multimedia, POS/POI/Kiosk
and Digital Signage